Demands are growing for semiconductors that offer higher performance and lower prices. To produce such semiconductors, polishing pads of different hardness are required. Polishing pads are used variously to enable nanometer wiring on semiconductor surfaces, to create mirror finishes that help to prevent crystal silicone damage, and to maintain silicon wafer quality characteristics. Reducing the amount of abrasive fluids without losing quality is a major challenge, but necessary to help lower silicon wafer manufacturing costs because the fluids account for a large portion of the costs. Teijin Frontier succeeded in development of new silicon pads realizing both stable quality and reducing cost by adopting ultra-fine fiber NANOFRONT utilizing its propriety yarn technology.
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